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SAM.govRef N0017326P2436

Semiconductor Die Bonding and Vacuum Packaging System

DDEPT OF THE NAVY logo
Contracting authorityDEPT OF THE NAVY
AwardGoodsNAICS 333993
Contract value$672,985
PublishedSep 15, 2026
LocationWashington, DC

Description

This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System.

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